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Enhancing Thermoelectric Performances of Bismuth Antimony Telluride via Synergistic Combination of Multiscale Structuring and Band Alignment by FeTe2 Incorporation

Authors
Shin, Weon HoRoh, Jong WookRyu, ByungkiChang, Hye JungKim, Hyun SikLee, SoonilSeo, Won SeonAhn, Kyunghan
Issue Date
Jan-2018
Publisher
AMER CHEMICAL SOC
Keywords
thermoelectric; BST; FeTe2; band alignment; nanoprecipitates; multiscale structuring
Citation
ACS APPLIED MATERIALS & INTERFACES, v.10, no.4, pp 3689 - 3698
Pages
10
Journal Title
ACS APPLIED MATERIALS & INTERFACES
Volume
10
Number
4
Start Page
3689
End Page
3698
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/45366
DOI
10.1021/acsami.7b18451
ISSN
1944-8244
1944-8252
Abstract
It has beeri a-difficulty to form well-distributed nano-and mesosized inclusions in a, Bi2Te3-based matrix and thereby realizing no degradation of carrier mobility at interfaces between matrix and inclusions for high thermoelectric performances. Herein, we Successfully synthesize multistructured thermoelectric Bi0.4Sb1.6Te3 materials with Fe-rich nano precipitates and sub-micron FeTe2 inclusions by a conventional solid-state reaction followed by melt-spinning, and spark plasma sintering that could be a facile preparation method for scale-up production. This study presents a bismuth antimony telluride based thermoelectric material with a multiscale structure whose lattice thermal conductivity is drastically reduced with minimal degradation on its carrier mobility. This is possible because a carefully chosen FeTe2 incorporated in the matrix allows its interfacial valence band with the matrix to be aligned, leading to a significantly improved p-type thermoelectric power factor. Consequently, an impressively high thermoelectric figure of merit ZT of 1.52 is achieved at 396 K for p-type Bi0.4Sb1.6Te3-8 mol % FeTe2, which is a 43% enhancement in ZT compared to the pristine Bi0.4Sb1.6Te3. This work demonstrates riot billy the effectiveness of multiscale structuring, for lowering lattice thermal conductivities, but also the importance of interfacial band alignment between matrix and inclusions for maintaining high carrier mobilities when designing high-performance thermoelectric materials.
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