Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surfaceopen access
- Authors
- Lee, Wondu; Kim, Jooheon
- Issue Date
- Mar-2021
- Publisher
- MDPI
- Keywords
- polymer-matrix composites (PMCs); thermal conductivity; 3D network; sintering
- Citation
- POLYMERS, v.13, no.5, pp 1 - 12
- Pages
- 12
- Journal Title
- POLYMERS
- Volume
- 13
- Number
- 5
- Start Page
- 1
- End Page
- 12
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/47785
- DOI
- 10.3390/polym13050694
- ISSN
- 2073-4360
2073-4360
- Abstract
- In this study, a new fabrication technique for three-dimensional (3D) filler networks was employed for the first time to prepare thermally conductive composites. A silver nanowire (AgNW)- aluminum nitride (AlN) (AA) filler was produced by a polyol method and hot-pressed in mold to connect the adjacent fillers by sintering AgNWs on the AlN surface. The sintered AA filler formed a 3D network, which was subsequently impregnated with epoxy (EP) resin. The fabricated EP/AA 3D network composite exhibited a perpendicular direction thermal conductivity of 4.49 W m(-1) K-1 at a filler content of 400 mg (49.86 vol.%) representing an enhancement of 1973% with respect to the thermal conductivity of neat EP (0.22 W m(-1) K-1). Moreover, the EP/AA decreased the operating temperature of the central processing unit (CPU) from 86.2 to 64.6 degrees C as a thermal interface material (TIM). The thermal stability was enhanced by 27.28% (99 degrees C) and the composites showed insulating after EP infiltration owing to the good insulation properties of AlN and EP. Therefore, these fascinating thermal and insulating performances have a great potential for next generation heat management application.
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