Process condition diagram predicting onset of microdefects and fracture in cold bar drawingopen access
- Authors
- Roh, Yong-Hoon; Cho, Donghyuk; Choi, Hae-Chang; Yang, Zhaorui; Lee, Youngseog
- Issue Date
- Mar-2021
- Publisher
- MDPI AG
- Keywords
- Cumulative damage; Drawing test; Microcracks; Microvoid; Process condition diagram; SEM
- Citation
- Metals, v.11, no.3, pp 1 - 14
- Pages
- 14
- Journal Title
- Metals
- Volume
- 11
- Number
- 3
- Start Page
- 1
- End Page
- 14
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/48400
- DOI
- 10.3390/met11030479
- ISSN
- 2075-4701
2075-4701
- Abstract
- This paper presents a process condition diagram (PCD) that not only identifies conditions under which materials fracture during bar drawing, but also infers the presence or absence of mi-crodefects such as microvoids and microcracks in the drawn material as accumulative damage changes owing to the die semi-angle and reduction ratio. The accumulative damage values were calculated by finite element (FE) analysis. The critical damage values were determined by performing a tensile test using a smooth round bar tensile specimen and performing FE analysis sim-ulating the tensile test. High alloy steel with a 13 mm diameter was used for the draw bench testing in a wide range of drawing conditions. Scanning electron microscopy (SEM) analysis was performed to verify the usefulness of the PCD. SEM images showed that the accumulative damage roughly matched the size of microvoids around the non-metallic inclusions and the creation of microcracks, which eventually led to fractures of material being drawn. Hence, utilizing the pro-posed PCD, a process designer can design drawing conditions that minimize the occurrence of microdefects in the material being drawn while maximizing the reduction ratio. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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