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A review on the deformation behavior of silver nanowire networks under many bending cycles

Authors
Seo, YoungjaeHa, HeeboMatteini, PaoloHwang, Byungil
Issue Date
May-2021
Publisher
MDPI AG
Keywords
Bending; Deformation; Reliability; Silver nanowire; Transparent electrode
Citation
Applied Sciences (Switzerland), v.11, no.10
Journal Title
Applied Sciences (Switzerland)
Volume
11
Number
10
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/50947
DOI
10.3390/app11104515
ISSN
2076-3417
2076-3417
Abstract
Silver nanowire networks are attractive for flexible transparent electrodes due to their excellent optical transparency and electrical conductivity. Their mechanical reliability under bending is an important feature for the adoption of silver nanowire transparent electrodes for flexible elec-tronics. Therefore, various studies have been conducted to understand the deformation behavior of silver nanowire networks, which are different from those of bulk silver or silver thin films. The focus of this review is to elucidate the deformation mechanism of silver nanowire networks under high cycles of bending and to present ways to improve the mechanical reliability of silver nanowire transparent electrodes. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.
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