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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
open access
하민정; 김지호; 한재구; 양진석;
김종민
; 임병승
Article
Issue Date
2022
Citation
대한용접접합학회지, v.40, no.3, pp 242 - 247
Publisher
대한용접접합학회
1
Discover
Author
Kim, Jong Min
1
양진석
1
하민정
1
한재구
1
Subject
Conduction path
1
Electrically conductive adhesiv...
1
High-melting-point alloy (HMPA)
1
Low-melting-point alloy (LMPA)
1
Polymeric composite
1
Date Issued
2022
1
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Article
1
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