Effect of viscosity of liquid resin on resin self-alignment capability
- Authors
- Kim, J.M.; Shin, Y.E.; Fujimoto, K.
- Issue Date
- Sep-2003
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Keywords
- lead-free; low process temperature; microelectromechanical systems (MEMS); micro-opto-electro-mechanical systems (MOEMS); optoelectronic multichip modules (OE-MCMs); self-alignment
- Citation
- ECO-MATERIALS PROCESSING & DESIGN, v.439, pp 12 - 17
- Pages
- 6
- Journal Title
- ECO-MATERIALS PROCESSING & DESIGN
- Volume
- 439
- Start Page
- 12
- End Page
- 17
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/53151
- DOI
- 10.4028/www.scientific.net/MSF.439.12
- ISSN
- 0255-5476
- Abstract
- We developed highly precise self-alignment process using resin materials for next generation microelectromechanical systems (MEMS), micro-opto-electro-mechanical systems (MOEMS) and optoelectronic multichip modules (OE-MCMs) applications. Although liquid resins have a characteristic as low as one tenth of the surface tension of solder in general, self-alignment capability could be achieved by using 3-D pads for positioning boundary. In this research, we propose the novel passive alignment mechanism in order to enhance understanding of alignment motion. Moreover, the influence of viscosity on alignment motion and alignment accuracy is demonstrated by scaled-up experiment. We could achieve highly precise alignment accuracy less than 0.4 mum.
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- Appears in
Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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