Adhesive joining process and thermomechanical property of anisotropic conductive adhesive

Kim, Hyomi; Kim, JooHeon

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Adhesive joining process and thermomechanical property of anisotropic conductive adhesive

Authors: Kim, Hyomi; Kim, JooHeon

Issue Date: Aug-2009

Publisher: AMER CHEMICAL SOC

Citation: ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, v.238

Journal Title: ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY

Volume: 238

URI: https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/65225

ISSN: 0065-7727

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Appears in Collections: College of Engineering > School of Chemical Engineering and Material Science > 1. Journal Articles

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