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Effect of the intermetallic compounds on the joint strength of the optical module
- Authors
- Kim, N.K.; Kim, K.S.; Kim, N.H.; Chang, E.G.
- Issue Date
- Oct-2003
- Citation
- Proceedings - Electrochemical Society, v.11, pp 80 - 86
- Pages
- 7
- Journal Title
- Proceedings - Electrochemical Society
- Volume
- 11
- Start Page
- 80
- End Page
- 86
- ISSN
- 0000-0000
- Abstract
- Al / Au stud bumps and Cu / Sn-Pb solders were adopted, and aged for up to 900 hours to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6Sn5, scallop-shape IMC and planar-shape Cu3Sn were observed by transmission electron microscopy (TEM). IMC between Au stud bump and Al pad was identified as AlAu2. The formation of Kirkendall voids with the growth of IMC at the interface between solder and under bump metallurgy (UBM) was confirmed.
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