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플립 칩 BGA에서 2차 레벨 솔더접합부의 신뢰성 향상
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김경섭 | - |
| dc.contributor.author | 이석 | - |
| dc.contributor.author | 장의구 | - |
| dc.date.accessioned | 2023-03-09T03:43:00Z | - |
| dc.date.available | 2023-03-09T03:43:00Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.issn | 2466-2232 | - |
| dc.identifier.issn | 2466-2100 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/66148 | - |
| dc.format.extent | 5 | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | 플립 칩 BGA에서 2차 레벨 솔더접합부의 신뢰성 향상 | - |
| dc.title.alternative | The Improvement of 2nd Level Solder Joint Reliability for Flip Chip Ball Grid Array | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | 대한용접접합학회지, v.20, no.2, pp 90 - 94 | - |
| dc.identifier.kciid | ART000855044 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 94 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 90 | - |
| dc.citation.title | 대한용접접합학회지 | - |
| dc.citation.volume | 20 | - |
| dc.publisher.location | 대한민국 | - |
| dc.description.journalRegisteredClass | kci | - |
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