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플립 칩 BGA에서 2차 레벨 솔더접합부의 신뢰성 향상The Improvement of 2nd Level Solder Joint Reliability for Flip Chip Ball Grid Array
- Issue Date
- 2002
- Publisher
- 대한용접접합학회
- Citation
- 대한용접접합학회지, v.20, no.2, pp 90 - 94
- Pages
- 5
- Journal Title
- 대한용접접합학회지
- Volume
- 20
- Number
- 2
- Start Page
- 90
- End Page
- 94
- ISSN
- 2466-2232
2466-2100
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