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Simulation study of copper cluster deposition

Authors
Kang, J.C.Kang, J.W.Hwang, H.J.
Issue Date
Apr-2001
Publisher
Materials Research Society
Citation
Materials Research Society Symposium - Proceedings, v.672, pp O3.1.1 - O3.1.5
Journal Title
Materials Research Society Symposium - Proceedings
Volume
672
Start Page
O3.1.1
End Page
O3.1.5
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/66213
DOI
10.1557/proc-671-o3.1
ISSN
0272-9172
Abstract
The ionized cluster beam deposition of Al and Cu clusters has been investigated with a classical molecular dynamics simulation and the Metropolis Monte Carlo simulation. The spreading of the cluster has been studied as functions of cluster size and initial cluster energy. When the local area reached local melting spot on the surface, around the impact point of an energetic cluster, during a few ps, intermixing was easily achieved and a good epitaxial film with optimum bulk density was formed. For uniform film growth using cluster impact, it is necessary to make the local area temperature higher than melting temperature on the surface around the impact point of an energetic cluster.
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