Bias Polarity Dependent Resistive Switching Behaviors in Silicon Nitride-Based Memory Cell

Abstract

In this work, the bias polarity dependent resistive switching behaviors in Cu/Si3N4/p(+) Si RRAM memory cell have been closely studied. Different switching characteristics in both unipolar and bipolar modes after the positive forming are investigated. The bipolar switching did not need a forming process and showed better characteristics including endurance cycling, uniformity of switching parameters, and on/off resistance ratio. Also, the resistive switching characteristics by both positive and negative forming switching are compared. It has been confirmed that both unipolar and bipolar modes after the negative forming exhibits inferior resistive switching performances due to high forming voltage and current.