Improving thermal conductivity of epoxy composite by three-dimensional filler network constructed with two different diameters aluminum nitride and cellulose nanofiber
- Authors
- Yang, Wonyoung; Kim, Jihoon; Kim, Jooheon
- Issue Date
- Mar-2024
- Publisher
- SPRINGER
- Keywords
- Thermal conductivity; Aluminum nitride; 3D foam structure; Surface treatment
- Citation
- CELLULOSE, v.31, no.4, pp 2461 - 2474
- Pages
- 14
- Journal Title
- CELLULOSE
- Volume
- 31
- Number
- 4
- Start Page
- 2461
- End Page
- 2474
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/72845
- DOI
- 10.1007/s10570-024-05737-8
- ISSN
- 0969-0239
1572-882X
- Abstract
- With the rapid advances in electronic technology, efficient thermal dissipation has become a critical concern, and as a result, polymer composites are being utilized as various industrial areas. However, the relatively low thermal conductivity of polymers is a limitation that must be overcome. Hence, in this study, we prepared a 10-mu m aluminum nitride (AlN)@cellulose nanofiber (CNF) filler through a ball milling method. Following this, a 3D cellulose foam was fabricated using the AlN@CNF and a 4-mm aluminum nitride, which was obtained through freeze drying. Finally, the 3D foam was vacuum infiltrated with epoxy (EP) resin to fabricate the 3D-AlN@CNF1/AlN1/CNF/EP composite. Specifically, the 3D foam provided a continuous and efficient heat pathway, which increased the thermal conductivity from 0.2 to 1.88 W/mK with a 46.5 v/v% AlN loading. Additionally, the tensile stress and tensile strain were 34.8 MPa and 4.6%, respectively. Overall, these results suggest that the proposed 3D-AlN@CNF/AlN/EP composite is a promising material for efficient thermal management in various electronic devices.
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