열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구
- Authors
- 정상원; 강민수; 전유재; 김도석; 신영의
- Issue Date
- 2016
- Publisher
- 한국전기전자재료학회
- Keywords
- Lead-free solder; Thermal shock test; Intermetallic compounds; Shear test
- Citation
- 전기전자재료학회논문지, v.29, no.3, pp 152 - 158
- Pages
- 7
- Journal Title
- 전기전자재료학회논문지
- Volume
- 29
- Number
- 3
- Start Page
- 152
- End Page
- 158
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/8377
- DOI
- 10.4313/JKEM.2016.29.3.152
- ISSN
- 1226-7945
- Abstract
- MLCCs(multi layer ceramic capacitors, C1608) 시편의 SAC305 무연솔더 접합부의 접합특성 평가를 위해 열충격 시험(-40℃~125℃, total 1800cycle)을 수행하였다. 열충격 시험 후 IMCs(intermetallic compounds)의 성장과 균열을 확인하였으며 전단시험을 통해 접합특성 변화를 평가하였다. 또한 유한요소해석(FEA)을 통해 열충격 시험 전, 후 변화된 접합부에 대한 열응력분포의 차이를 분석하였고, 솔더접합부에서 형성된 IMCs가 접합특성 저하에 미치는 영향을 고찰하였다. 그 결과 IMCs가 솔더 내부에서 성장할 경우 솔더와 IMCs 계면에서 열응력집중이 커지게 되며 균열이 발생하고 진전되어 접합신뢰성 저하가 발생한다.
The bonding characteristics of MLCCs(multi layer ceramic capacitor, C1608)lead-free solder(SAC305) joints were evaluated through thermal shock test(-40℃~125℃, total 1,800cycle). After the test, IMCs(intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.
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