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Influence of temperament and anxiety on athletic performance

Han, Doug H.; Kim, Joo H.; Lee, Young S.; Bae, Soo Joeng; Bae, Soo Jin; Kim, Hyung J.; Sim, Min Y.; Sung, Young H.; Lyoo, In Kyoon

ArticleIssue Date2006CitationJOURNAL OF SPORTS SCIENCE AND MEDICINE, v.5, no.3, pp 381 - 389PublisherJOURNAL SPORTS SCIENCE & MEDICINE

Stimulating intrinsic motivation for problem solving using goal-oriented contexts and peer group composition

Song, Hae-Deok; Grabowski, Barbara L.

ArticleIssue Date2006CitationEducational Technology Research and Development, v.54, no.5, pp 445 - 466PublisherAssociation for Educational Communication and Technology (AECT)

Lesion of subthalarnic nucleus in parkinsonian rats: Effects of doparnine D1 and D2 receptor agonists on the neuronal activities of the substantia nigra pars reticulata

Park, Yong Sook; Jeon, Mi Fa; Lee, Bae Hwan; Chang, Jin Woo

ArticleIssue Date2007CitationJOURNAL OF KOREAN NEUROSURGICAL SOCIETY, v.42, no.6, pp 455 - 461PublisherKOREAN NEUROSURGICAL SOC

Anomaly-free flavor symmetry and neutrino anarchy

Berger, M.S.; Kim, Siyeon

ArticleIssue Date2001CitationPHYSICAL REVIEW D, v.63, no.5PublisherAMERICAN PHYSICAL SOC

Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Moffat, T. P.; Wheeler, D.; Kim, Soo-Kil; Josell, D.

ArticleIssue Date2007CitationELECTROCHIMICA ACTA, v.53, no.1, pp 145 - 154PublisherPERGAMON-ELSEVIER SCIENCE LTD

Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system - Reduction of overfill bump formation during superfilling

Kim, Soo-Kil; Josell, D.; Moffat, T. P.

ArticleIssue Date2006CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.9, pp C616 - C622PublisherELECTROCHEMICAL SOC INC

Direct plating of low resistivity bright Cu film onto TiN barrier layer via Pd activation

Kim, JJ; Kim, Soo-Kil; Kim, YS

ArticleIssue Date2004CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.1, pp C97 - C101PublisherELECTROCHEMICAL SOC INC

Additive-free superfilling in damascene Cu Electrodeposition using microcontact printing

Kim, Soo-Kil; Kim, JJ

ArticleIssue Date2004CitationELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.9, pp C101 - C103PublisherELECTROCHEMICAL SOC INC

Superfilling evolution in Cu electrodeposition - Dependence on the aging time of the accelerator

Kim, Soo-Kil; Kim, JJ

ArticleIssue Date2004CitationELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.9, pp C98 - C100PublisherELECTROCHEMICAL SOC INC

Superconformal Cu electrodeposition on various substrates

Kim, Soo-Kil; Cho, SK; Kim, JJ; Lee, YS

ArticleIssue Date2005CitationELECTROCHEMICAL AND SOLID STATE LETTERS, v.8, no.1, pp C19 - C21PublisherELECTROCHEMICAL SOC INC

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