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SCIESCOPUS
Removal mechanisms of glass and sapphire materials by slurry free lappingGo to Link

Moon, Deog ju; Yerriboina, Nagendra.Prasad; Cho, Si hyeong; Park, Sung ho; Seo, Young gil; Park, Jin-Goo

ArticleIssue Date2016Citation2015 International Conference on Planarization/CMP Technology, ICPT 2015, pp 1 - 4PublisherInstitute of Electrical and Electronics Engineers Inc.
SCIESCOPUS
Slurry free lapping of silicon wafer for the application of thinning of wafer backside during TSV and packagingGo to Link

Moon, Deog ju; Yerriboina, Nagendra Prasad; Cho, Si hyeong; Park, Sung ho; Seo, Young gil; Park, Jin-Goo

ArticleIssue Date2016Citation2015 International Conference on Planarization/CMP Technology, ICPT 2015, pp 1 - 3PublisherInstitute of Electrical and Electronics Engineers Inc.
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