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Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Kimoon | - |
| dc.contributor.author | Inoue, Fumihiro | - |
| dc.contributor.author | Derakhshandeh, Jaber | - |
| dc.contributor.author | Yoo, Bongyoung | - |
| dc.date.accessioned | 2022-07-18T01:17:29Z | - |
| dc.date.available | 2022-07-18T01:17:29Z | - |
| dc.date.created | 2022-05-30 | - |
| dc.date.issued | 2022-04 | - |
| dc.identifier.issn | 0021-4922 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/107914 | - |
| dc.description.abstract | Indium chloride bath was characterized towards the application of low-temperature thermal compression bonding. The electrochemical behavior of the indium chloride bath was analyzed using the cyclic voltammetry method. Electrochemical deposition of indium was carried out at various deposition factors on different materials such as copper, nickel, and cobalt. Based on the results of indium deposition obtained from the blanket films, indium bumps were electrochemically fabricated inside a through-resist hole pattern at various current densities. In addition, stacked indium bumps with various metals (Cu/In, Cu/Ni/In, Cu/Co/In) were formed for a practical application of micro bump bonding. Moreover, the formation of the intermetallic compounds between indium and under bump metallization was investigated. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | IOP Publishing Ltd | - |
| dc.title | Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Yoo, Bongyoung | - |
| dc.identifier.doi | 10.35848/1347-4065/ac52ba | - |
| dc.identifier.scopusid | 2-s2.0-85127269010 | - |
| dc.identifier.wosid | 000770132000001 | - |
| dc.identifier.bibliographicCitation | Japanese Journal of Applied Physics, v.61, no.4, pp.041003-1 - 041003-9 | - |
| dc.relation.isPartOf | Japanese Journal of Applied Physics | - |
| dc.citation.title | Japanese Journal of Applied Physics | - |
| dc.citation.volume | 61 | - |
| dc.citation.number | 4 | - |
| dc.citation.startPage | 041003-1 | - |
| dc.citation.endPage | 041003-9 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | ELECTRODEPOSITION | - |
| dc.subject.keywordPlus | TECHNOLOGY | - |
| dc.subject.keywordPlus | COPPER | - |
| dc.subject.keywordPlus | BUMPS | - |
| dc.subject.keywordAuthor | Micro-bump | - |
| dc.subject.keywordAuthor | Indium chloride bath | - |
| dc.subject.keywordAuthor | Intermetallic compounds | - |
| dc.identifier.url | https://iopscience.iop.org/article/10.35848/1347-4065/ac52ba | - |
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)