Fabrication of Open-Cell Microcellular Acrylonitrile Butadiene Styrene Composite Foams with Enhanced Electrical Conductivity and High-Performance Electromagnetic Interference Shielding
- Authors
- Han, Yingxia; Yu, Zhen; Zhang, Tao; Zhang, Xin; Phule, Ajit Dattatray; Zhang, Zhen Xiu; Jang, Sung Hwan
- Issue Date
- Mar-2022
- Publisher
- John Wiley & Sons Ltd.
- Keywords
- acrylonitrile butadiene styrene; conductive materials; electromagnetic shielding; poly (ethylene oxide); porous materials; supercritical foaming
- Citation
- Advanced Engineering Materials, v.24, no.3, pp 1 - 12
- Pages
- 12
- Indexed
- SCIE
SCOPUS
- Journal Title
- Advanced Engineering Materials
- Volume
- 24
- Number
- 3
- Start Page
- 1
- End Page
- 12
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/108187
- DOI
- 10.1002/adem.202101020
- ISSN
- 1438-1656
1527-2648
- Abstract
- Porous materials are becoming progressively more popular because of their potential applications in the fields of oil-water separation, drug delivery, gas adsorption, and chemical sensing. Herein, acrylonitrile butadiene styrene (ABS) porous materials by the etching method and supercritical CO2 (SC-CO2) foaming after the etching method are proposed. On this basis, ABS porous conductive composites are prepared by adding conductive carbon black (CCB). The results show that as the content of poly (ethylene oxide) (PEO) in the blend increases to 50 phr, the ABS materials prepared by SC-CO2 foaming after the etching method all become open-cell structures. When the content of CCB reaches 6%, the conductivity of ABS porous materials prepared by the etching method is 2.56 Sm-1; after etching, the conductivity of ABS porous materials prepared by SC-CO2 foaming can reach 15 Sm-1 and electromagnetic shielding can reach 23 dB. When the content of CCB is greater than 6%, the conductivity is significantly improved. The conductivity of the ABS open-pore materials prepared by the two methods can reach 15 Sm-1, and the maximum electromagnetic shielding can reach 33 dB. The developed foam has a great potential in electronics and electromagnetic interference (EMI) shielding application.
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