Emerging laser-assisted vacuum processes for ultra-precision, high-yield manufacturing
- Authors
- Hwang, Eunseung; Choi, Joonmyung; Hong, Sukjoon
- Issue Date
- Nov-2022
- Publisher
- Royal Society of Chemistry
- Citation
- Nanoscale, v.14, no.43, pp 16065 - 16076
- Pages
- 12
- Indexed
- SCIE
SCOPUS
- Journal Title
- Nanoscale
- Volume
- 14
- Number
- 43
- Start Page
- 16065
- End Page
- 16076
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/111167
- DOI
- 10.1039/d2nr03649e
- ISSN
- 2040-3364
2040-3372
- Abstract
- Laser technology is a cutting-edge process with a unique photothermal response, precise site selectivity, and remote controllability. Laser technology has recently emerged as a novel tool in the semiconductor, display, and thin film industries by providing additional capabilities to existing high-vacuum equipment. The in situ and in operando laser assistance enables using multiple process environments with a level of complexity unachievable with conventional vacuum equipment. This broadens the usable range of process parameters and directly improves material properties, product precision, and device performance. This review paper examines the recent research trends in laser-assisted vacuum processes (LAVPs) as a vital tool for innovation in next-generation manufacturing processing equipment and addresses the unique characteristics and mechanisms of lasers exclusively used in each study. All the findings suggest that the LAVP can lead to methodological breakthroughs in dry etching, 2D material synthesis, and chemical vapor deposition for optoelectronic devices.
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