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Detailed Characterization of Short-Wave Infrared Colloidal Quantum Dot Image Sensors

Authors
Kim, Joo HyoungPejovic, VladimirGeorgitzikis, EpimitheasLi, YunlongKim, JaenamMalinowski, Pawel E.Lieberman, ItaiCheyns, DavidHeremans, PaulLee, Jiwon
Issue Date
Jun-2022
Publisher
Institute of Electrical and Electronics Engineers
Keywords
Dark current spectroscopy (DCS); image lag; infrared image sensors; quantum dots; short-wave infrared (SWIR); suppressed blooming; thin-film sensors
Citation
IEEE Transactions on Electron Devices, v.69, no.6, pp 2900 - 2906
Pages
7
Indexed
SCIE
SCOPUS
Journal Title
IEEE Transactions on Electron Devices
Volume
69
Number
6
Start Page
2900
End Page
2906
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/112874
DOI
10.1109/TED.2022.3164997
ISSN
0018-9383
1557-9646
Abstract
Thin-film-based image sensors feature a thin-film photodiode (PD) monolithically integrated on CMOS readout circuitry. They are getting significant attention as an imaging platform for wavelengths beyond the reach of Si PDs, i.e., for photon energies lower than 1.12 eV. Among the promising candidates for converting low-energy photons to electric charge carriers, lead sulfide (PbS) colloidal quantum dot (CQD) photodetectors are particularly well suited. However, despite the dynamic research activities in the development of these thin-film-based image sensors, no in-depth study has been published on their imaging characteristics. In this work, we present an elaborate analysis of the performance of our short-wave infrared (SWIR) sensitive PbS CQD imagers, which achieve external quantum efficiency (EQE) up to 40% at the wavelength of 1450 nm. Image lag is characterized and compared with the temporal photoresponsivity of the PD. We show that blooming is suppressed because of the restricted pixel-to-pixel movement of the photo-generated charge carriers within the bottom transport layer (BTL) of the PD stack. Finally, we perform statistical analysis of the activation energy for CQD by dark current spectroscopy (DCS), which is an implementation of a well-known methodology in Si-based imagers for defect engineering to a new class of imagers. © 1963-2012 IEEE.
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