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Observation of highly anisotropic thermal expansion of polymer films

Authors
Chaikasetsin, SettasitJung, Jun YoungKim, HongdeokKim, Brian S. Y.Seo, JungjuChoi, JoonmyungBae, KihoPark, Woosung
Issue Date
May-2023
Publisher
American Chemical Society
Keywords
thermal expansion; anisotropy; polymerthinfilm; microstructure; soft matters
Citation
ACS Applied Materials & Interfaces, v.15, no.22, pp 1 - 7
Pages
7
Indexed
SCIE
SCOPUS
Journal Title
ACS Applied Materials & Interfaces
Volume
15
Number
22
Start Page
1
End Page
7
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/113154
DOI
10.1021/acsami.3c03728
ISSN
1944-8244
1944-8252
Abstract
Whiledimensional change under thermal loading dictates variousdevice failure mechanisms in soft materials, the interplay betweenmicrostructures and thermal expansion remains underexplored. Here,we develop a novel method to directly probe the thermal expansionfor nanoscale polymer films using an atomic force microscope as wellas confining active thermal volume. In a model system, spin-coatedpoly-(methyl methacrylate), we find that the in-plane thermal expansionis enhanced by 20-fold compared to that along the out-of-plane directionsin confined dimensions. Our molecular dynamics simulations show thatthe collective motion of side groups along backbone chains uniquelydrives the enhancement of thermal expansion anisotropy of polymersin the nanoscale limit. This work unveils the intimate role of themicrostructure of polymer films on its thermal-mechanical interaction,paving a route to judiciously enhance the reliability in a broad rangeof thin-film devices.
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MECHANICAL ENGINEERING > 1. Journal Articles

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