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The Effect of Thermal Aging on Nano-Particle Removal
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Yeoho | - |
| dc.contributor.author | Jin, Seung-Wan | - |
| dc.contributor.author | Kim, Hyun-Tae | - |
| dc.contributor.author | Kim, Tae-Gon | - |
| dc.contributor.author | Won, Kyu-Hwang | - |
| dc.contributor.author | Park, Jin Goo | - |
| dc.date.accessioned | 2023-07-05T06:31:01Z | - |
| dc.date.available | 2023-07-05T06:31:01Z | - |
| dc.date.issued | 2021-02 | - |
| dc.identifier.issn | 1012-0394 | - |
| dc.identifier.issn | 1662-9779 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/113552 | - |
| dc.description.abstract | The adhesion behavior of thermally aged particles was studied by characterizing the footprint, which could be formed between a particle and a substrate. To understand the formation mechanism of the footprint, the effects of temperature and aging time on the particle removal were studied. Understanding the particle adhesion and removal aged at high temperatures is important to maintain the cleanness of the wafer backside where many contaminants could adhere on in various wafer process chambers. | - |
| dc.format.extent | 6 | - |
| dc.language | 한국어 | - |
| dc.language.iso | KOR | - |
| dc.publisher | Scitec Publications Ltd. | - |
| dc.title | The Effect of Thermal Aging on Nano-Particle Removal | - |
| dc.type | Article | - |
| dc.publisher.location | 스위스 | - |
| dc.identifier.doi | 10.4028/www.scientific.net/SSP.314.228 | - |
| dc.identifier.scopusid | 2-s2.0-85101972945 | - |
| dc.identifier.bibliographicCitation | Solid State Phenomena, v.314 , pp 228 - 233 | - |
| dc.citation.title | Solid State Phenomena | - |
| dc.citation.volume | 314 | - |
| dc.citation.startPage | 228 | - |
| dc.citation.endPage | 233 | - |
| dc.type.docType | 정기학술지(Article(Perspective Article포함)) | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordAuthor | Cleaning | - |
| dc.subject.keywordAuthor | Footprint | - |
| dc.subject.keywordAuthor | Particle Defect | - |
| dc.subject.keywordAuthor | Thermal aging | - |
| dc.subject.keywordAuthor | Wafer backside | - |
| dc.identifier.url | https://www.scientific.net/SSP.314.228 | - |
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)