Pole-Controlled Wideband 120 GHz CMOS Power Amplifier for Wireless Chip-to-Chip Communication in 40-nm CMOS Process
- Authors
- Son, Hyuk Su; Jang, Tae Hwan; Kim, Seung Hun; Jung, Kyung Pil; Kim, Joon Hyung; Park, Chul Soon
- Issue Date
- Aug-2019
- Publisher
- Institute of Electrical and Electronics Engineers
- Keywords
- CMOS; D-band; linearizer; millimeter wave (mm-wave); power amplifier (PA); power combiner; sub-THz; transformer; W-band; wideband
- Citation
- IEEE Transactions on Circuits and Systems II: Express Briefs, v.66, no.8, pp 1351 - 1355
- Pages
- 5
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- IEEE Transactions on Circuits and Systems II: Express Briefs
- Volume
- 66
- Number
- 8
- Start Page
- 1351
- End Page
- 1355
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/114203
- DOI
- 10.1109/TCSII.2018.2880308
- ISSN
- 1549-7747
1558-3791
- Abstract
- This brief proposes a wideband CMOS power amplifier (PA) with flat gain using a pole-controlled transformer in the sub-THz band for wireless chip-to-chip communication. An analysis of the transformer-based interstage matching network is presented, which indicates a zero in-band ripple condition. For verification, a pole-controlled PA (with an area of 0.33 mm2 including PADs) is fabricated using a 40-nm CMOS process and measured. The proposed PA achieves a measured 3-dB bandwidth of 38.5 GHz from 96.5 GHz-to-135 GHz, small-signal gain of 15.8 dB, and saturated output power of 14.6 dBm with a peak power-added efficiency (PAEMAX) of 9.44%. The proposed PA shows state-of-the-art performance with respect to the bandwidth and other figures of merit. © 2018 IEEE.
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