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Effects of Current, Temperature, and Chip Size on the Performance of AlGaInP-Based Red Micro-Light-Emitting Diodes with Different Contact Schemes

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dc.contributor.authorLee, Da-Hoon-
dc.contributor.authorLee, Sang-Youl-
dc.contributor.authorShim, Jong-In-
dc.contributor.authorSeong, Tae-Yeon-
dc.contributor.authorAmano, Hiroshi-
dc.date.accessioned2023-08-16T08:31:03Z-
dc.date.available2023-08-16T08:31:03Z-
dc.date.issued2021-09-
dc.identifier.issn2162-8769-
dc.identifier.issn2162-8777-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/114302-
dc.description.abstractWe have investigated the performance of AlGaInP-based red micro-light-emitting diodes (micro-LEDs) with different n-type contact schemes as functions of current, ambient temperature, and chip size. The samples with AuGe/Ni/Au contact revealed wider full width at half maximum of electroluminescence than that with the Pd/Ge contact. All samples also exhibited broad peaks at wavelengths between ∼632 and ∼640 nm, whose intensity depended on the type of contact schemes and temperature. Regardless of the contact schemes, the 10 μm-size samples showed a larger temperature-dependent reduction in the output power at current density of ˂50 A cm−2 than the 100 μm-size ones. Above 100 A cm−2, however, both samples showed similar temperature dependence. Irrespective of the contact schemes, the main peak of the 100-μm samples was red-shifted, whereas no red-shift was detected in the 10-μm samples. The third peak of the AuGe-based contact samples became more dominant at 700 A cm−2 than the main peak, whereas that of the PdGe contact samples became more dominant at 1000 A cm−2. Based on the chip size, current, contact scheme, and temperature dependence, the performance degradation of the red micro-LEDs is described and discussed.-
dc.format.extent6-
dc.language영어-
dc.language.isoENG-
dc.publisherElectrochemical Society, Inc.-
dc.titleEffects of Current, Temperature, and Chip Size on the Performance of AlGaInP-Based Red Micro-Light-Emitting Diodes with Different Contact Schemes-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1149/2162-8777/ac2029-
dc.identifier.scopusid2-s2.0-85115219035-
dc.identifier.wosid000692594300001-
dc.identifier.bibliographicCitationECS Journal of Solid State Science and Technology, v.10, no.9, pp 1 - 6-
dc.citation.titleECS Journal of Solid State Science and Technology-
dc.citation.volume10-
dc.citation.number9-
dc.citation.startPage1-
dc.citation.endPage6-
dc.type.docType정기학술지(Article(Perspective Article포함))-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusEFFICIENCY-
dc.subject.keywordPlusLEDS-
dc.subject.keywordPlusGAN-
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/2162-8777/ac2029-
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ERICA 첨단융합대학 (ERICA 반도체·디스플레이공학전공)
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