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Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
- Issue Date
- May-2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- Copper-to-copper direct bonding; Electric current; Three-dimensional integration
- Citation
- 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), v.2023-May, pp 2120 - 2124
- Pages
- 5
- Indexed
- SCI
SCOPUS
- Journal Title
- 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
- Volume
- 2023-May
- Start Page
- 2120
- End Page
- 2124
- ISSN
- 0569-5503
2377-5726
- Abstract
- In this paper, an alternative copper-to-copper direct bonding method is investigated through electric current-induced bonding, which is the enhancement method for forming copper-to-copper bonding using electric current. Electric current has two driving forces for copper-to-copper bonding: joule heat caused by electric current and electron wind force. These factors influenced the bonding formation by momentum transfer and additional diffusivity to copper atoms, so the interface of each copper pad quickly disappeared. © 2023 IEEE.
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)