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Characterization of Alkaline Cu/Ti Slurry for TSV Chemical Mechanical Planarization
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김태곤 | - |
| dc.date.accessioned | 2024-02-10T08:30:52Z | - |
| dc.date.available | 2024-02-10T08:30:52Z | - |
| dc.date.issued | 2023-11-20 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/118086 | - |
| dc.title | Characterization of Alkaline Cu/Ti Slurry for TSV Chemical Mechanical Planarization | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | Korean International Semiconductor Conference on Manufacturing Technology 2023 | - |
| dc.citation.conferencePlace | Busan, Korea | - |
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Related Researcher
- KIM, TAE GON
- ERICA 공학대학 (MAJOR IN APPLIED MATERIAL & COMPONENTS)