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Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김태곤 | - |
| dc.date.accessioned | 2025-01-04T13:01:59Z | - |
| dc.date.available | 2025-01-04T13:01:59Z | - |
| dc.date.issued | 2024-10-17 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/121633 | - |
| dc.title | Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 19th International Conference on Planarization/CMP Technology 2024 | - |
| dc.citation.conferencePlace | Kurhaus Wiesbaden Germany | - |
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Related Researcher
- KIM, TAE GON
- ERICA 공학대학 (MAJOR IN APPLIED MATERIAL & COMPONENTS)