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A 65 nm Temporally Hardened Flip-Flop Circuit

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dc.contributor.authorLi, Y. -Q.-
dc.contributor.authorWang, H. -B.-
dc.contributor.authorLiu, Rui-
dc.contributor.authorChen, Li-
dc.contributor.authorNofal, Issam-
dc.contributor.authorChen, Q. -Y.-
dc.contributor.authorHe, A. -L.-
dc.contributor.authorGuo, Gang-
dc.contributor.authorBaeg, Sang H.-
dc.contributor.authorWen, Shi-Jie-
dc.contributor.authorWong, Richard-
dc.contributor.authorWu, Qiong-
dc.contributor.authorChen, Mo-
dc.date.accessioned2021-06-22T15:44:25Z-
dc.date.available2021-06-22T15:44:25Z-
dc.date.created2021-01-21-
dc.date.issued2016-12-
dc.identifier.issn0018-9499-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/12184-
dc.description.abstractA guard-gate based flip-flop circuit temporally hardened against single-event effects is presented in this paper. Compared to several existed techniques, the organization of components inside the proposed design allows the improved performance- only one tau (the maximum width of a single-event transient (SET) to tolerate) is added into the setup time. A previously reported low-power delay element is applied, which helps make the proposed design power-efficient. The proposed design was implemented in a 65 nm CMOS bulk technology. Alpha and heavy-ions radiation experiments were performed to characterize its soft-error rates. Experimental results show that the proposed design presents no error with LETs up to 37.3 MeV-cm(2)/mg. Simulation results from the TFIT further validate the experimental results.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleA 65 nm Temporally Hardened Flip-Flop Circuit-
dc.typeArticle-
dc.contributor.affiliatedAuthorBaeg, Sang H.-
dc.identifier.doi10.1109/TNS.2016.2608911-
dc.identifier.scopusid2-s2.0-85027031848-
dc.identifier.wosid000391693100025-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.63, no.6, pp.2934 - 2940-
dc.relation.isPartOfIEEE TRANSACTIONS ON NUCLEAR SCIENCE-
dc.citation.titleIEEE TRANSACTIONS ON NUCLEAR SCIENCE-
dc.citation.volume63-
dc.citation.number6-
dc.citation.startPage2934-
dc.citation.endPage2940-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaNuclear Science & Technology-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNuclear Science & Technology-
dc.subject.keywordPlusCMOS TECHNOLOGY-
dc.subject.keywordPlusHEAVY-ION-
dc.subject.keywordPlusGUARD-GATES-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusUPSET-
dc.subject.keywordPlusSENSITIVITY-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusMECHANISMS-
dc.subject.keywordPlusSRAMS-
dc.subject.keywordPlusPOWER-
dc.subject.keywordAuthorFlip-flop-
dc.subject.keywordAuthorSET-
dc.subject.keywordAuthorSEU-
dc.subject.keywordAuthortemporal hardening-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7565582-
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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