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PC Modular Panel 내진보강공법 적용 R/C 기둥의 내진성능평가를 위한 전산해석적 연구
- Authors
- 이강석
- Issue Date
- 25-Apr-2024
- Place
- 과학기술컨벤션센터(한국과학기술회관, 서울 강남구 소재)
- Conference Name
- 대한건축학회 춘계학술대회
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Related Researcher
- LEE, KANG SEOK
- ERICA 공학대학 (MAJOR IN ARCHITECTURAL ENGINEERING)