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TSV기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박성주 | - |
| dc.contributor.author | 정지훈 | - |
| dc.date.accessioned | 2025-04-09T03:01:50Z | - |
| dc.date.available | 2025-04-09T03:01:50Z | - |
| dc.date.issued | 2012-06-27 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/124811 | - |
| dc.language | 한국어 | - |
| dc.language.iso | KOR | - |
| dc.title | TSV기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술 | - |
| dc.type | Conference | - |
| dc.citation.title | 한국반도체테스트학술대회 | - |
| dc.citation.conferenceName | 제13회 한국테스트 학술대회 | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferencePlace | 서울교육문화회관 | - |
| dc.citation.conferenceDate | 2012-06-27 | - |
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