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TSV기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술
- Issue Date
- 27-Jun-2012
- Conference Name
- 한국반도체테스트학술대회
- Place
- 대한민국
서울교육문화회관
- Conference Date
- 2012-06-27
- Conference Name
- 제13회 한국테스트 학술대회
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Collections - COLLEGE OF COMPUTING > SCHOOL OF COMPUTER SCIENCE > 2. Conference Papers
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