Enhancing Underfill Adhesion with Triazole-Modified Silane Coupling Agents: Synthesis and Failure Surface Analysis

Abstract

To enhance the adhesion performance of underfill materials in electronic packaging, a triazole-silane coupling agent (TSCA) was synthesized and compared with conventional silane coupling agents. FT-IR analysis confirmed the successful formation of TSCA, and its effect on adhesion was systematically evaluated. TSCA demonstrated superior adhesion stability across various temperatures, maintaining interfacial bonding and minimizing shrinkage-induced detachment. In contrast, other silane agents exhibited limitations due to excessive cross-linking or shrinkage at high temperatures. Morphological analysis of the failure surface via SEM further revealed that TSCA retained interfacial integrity better than other agents, contributing to improved adhesion reliability. These findings suggest that TSCA is a highly effective silane coupling agent for underfill applications, offering enhanced adhesion performance and structural stability, making it a promising candidate for improving the reliability of electronic packaging materials.