A Simple Extraction Method of Thermal Resistance in Multifinger GaAs HBT
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Goh, Gyeongjun | - |
dc.contributor.author | Kim, Unha | - |
dc.contributor.author | Jeon, Moon-Suk | - |
dc.contributor.author | Kim, Junghyun | - |
dc.date.accessioned | 2021-06-22T16:42:54Z | - |
dc.date.available | 2021-06-22T16:42:54Z | - |
dc.date.issued | 2016-06 | - |
dc.identifier.issn | 0018-9383 | - |
dc.identifier.issn | 1557-9646 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/13612 | - |
dc.description.abstract | A novel extraction method to estimate the thermal resistance (R-th) of a multifinger GaAs heterojunction bipolar transistor (HBT) device is presented based on the simplified Fourier's law. By calculating the thermal coupling resistance between the fingers on top of the self-heating thermal resistance, the values of R-th of multifinger devices for various dimensions are accurately calculated while maintaining the simplicity of calculation. To verify the idea, the proposed method is compared with the measurement-based method as well as the analytic methods, such as the finite-element method and the solution of 3-D Laplace's equation. For four-finger HBT devices, the extracted R-th results showed good agreements with the analytic methods within an error of 9% and the measurement-based results with a deviation of 7.4%, thus convincing the usefulness of the proposed method. | - |
dc.format.extent | 5 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | A Simple Extraction Method of Thermal Resistance in Multifinger GaAs HBT | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1109/TED.2016.2556086 | - |
dc.identifier.scopusid | 2-s2.0-84966283938 | - |
dc.identifier.wosid | 000378592800060 | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON ELECTRON DEVICES, v.63, no.6, pp 2620 - 2624 | - |
dc.citation.title | IEEE TRANSACTIONS ON ELECTRON DEVICES | - |
dc.citation.volume | 63 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 2620 | - |
dc.citation.endPage | 2624 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | JUNCTION TEMPERATURE | - |
dc.subject.keywordPlus | TRANSISTORS | - |
dc.subject.keywordPlus | CIRCUITS | - |
dc.subject.keywordPlus | DEVICES | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | MODEL | - |
dc.subject.keywordAuthor | Heterojunction bipolar transistor (HBT) | - |
dc.subject.keywordAuthor | multifinger | - |
dc.subject.keywordAuthor | self-heating | - |
dc.subject.keywordAuthor | thermal coupling | - |
dc.subject.keywordAuthor | thermal resistance | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/7463485 | - |
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