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A Simple Extraction Method of Thermal Resistance in Multifinger GaAs HBT

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dc.contributor.authorGoh, Gyeongjun-
dc.contributor.authorKim, Unha-
dc.contributor.authorJeon, Moon-Suk-
dc.contributor.authorKim, Junghyun-
dc.date.accessioned2021-06-22T16:42:54Z-
dc.date.available2021-06-22T16:42:54Z-
dc.date.issued2016-06-
dc.identifier.issn0018-9383-
dc.identifier.issn1557-9646-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/13612-
dc.description.abstractA novel extraction method to estimate the thermal resistance (R-th) of a multifinger GaAs heterojunction bipolar transistor (HBT) device is presented based on the simplified Fourier's law. By calculating the thermal coupling resistance between the fingers on top of the self-heating thermal resistance, the values of R-th of multifinger devices for various dimensions are accurately calculated while maintaining the simplicity of calculation. To verify the idea, the proposed method is compared with the measurement-based method as well as the analytic methods, such as the finite-element method and the solution of 3-D Laplace's equation. For four-finger HBT devices, the extracted R-th results showed good agreements with the analytic methods within an error of 9% and the measurement-based results with a deviation of 7.4%, thus convincing the usefulness of the proposed method.-
dc.format.extent5-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleA Simple Extraction Method of Thermal Resistance in Multifinger GaAs HBT-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TED.2016.2556086-
dc.identifier.scopusid2-s2.0-84966283938-
dc.identifier.wosid000378592800060-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON ELECTRON DEVICES, v.63, no.6, pp 2620 - 2624-
dc.citation.titleIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.citation.volume63-
dc.citation.number6-
dc.citation.startPage2620-
dc.citation.endPage2624-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusJUNCTION TEMPERATURE-
dc.subject.keywordPlusTRANSISTORS-
dc.subject.keywordPlusCIRCUITS-
dc.subject.keywordPlusDEVICES-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusMODEL-
dc.subject.keywordAuthorHeterojunction bipolar transistor (HBT)-
dc.subject.keywordAuthormultifinger-
dc.subject.keywordAuthorself-heating-
dc.subject.keywordAuthorthermal coupling-
dc.subject.keywordAuthorthermal resistance-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7463485-
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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