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Quantifying the Risk Level of Functional Chips in DRAM Wafers

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dc.contributor.authorJeong, Young-Seon-
dc.contributor.authorKim, Byunghoon-
dc.contributor.authorTong, Seung Hoon-
dc.contributor.authorChang, In-Kap-
dc.contributor.authorJeong, Myong K.-
dc.date.accessioned2021-06-22T18:43:27Z-
dc.date.available2021-06-22T18:43:27Z-
dc.date.created2021-02-18-
dc.date.issued2015-11-
dc.identifier.issn1541-1672-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/16534-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE COMPUTER SOC-
dc.titleQuantifying the Risk Level of Functional Chips in DRAM Wafers-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Byunghoon-
dc.identifier.bibliographicCitationIEEE INTELLIGENT SYSTEMS, v.30, no.6, pp.21 - 24-
dc.relation.isPartOfIEEE INTELLIGENT SYSTEMS-
dc.citation.titleIEEE INTELLIGENT SYSTEMS-
dc.citation.volume30-
dc.citation.number6-
dc.citation.startPage21-
dc.citation.endPage24-
dc.type.rimsART-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7320917-
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ERICA 공학대학 (DEPARTMENT OF INDUSTRIAL & MANAGEMENT ENGINEERING)
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