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Quantifying the Risk Level of Functional Chips in DRAM Wafers

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dc.contributor.authorJeong, Young-Seon-
dc.contributor.authorKim, Byunghoon-
dc.contributor.authorTong, Seung Hoon-
dc.contributor.authorChang, In-Kap-
dc.contributor.authorJeong, Myong K.-
dc.date.accessioned2021-06-22T18:43:27Z-
dc.date.available2021-06-22T18:43:27Z-
dc.date.issued2015-11-
dc.identifier.issn1541-1672-
dc.identifier.issn1941-1294-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/16534-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleQuantifying the Risk Level of Functional Chips in DRAM Wafers-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.wosid000365030200007-
dc.identifier.bibliographicCitationIEEE Intelligent Systems, v.30, no.6, pp 21 - 24-
dc.citation.titleIEEE Intelligent Systems-
dc.citation.volume30-
dc.citation.number6-
dc.citation.startPage21-
dc.citation.endPage24-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryComputer Science, Artificial Intelligence-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
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ERICA 공학대학 (DEPARTMENT OF INDUSTRIAL & MANAGEMENT ENGINEERING)
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