A Multi-Mode Multi-Band Reconfigurable Power Amplifier for 2G/3G/4G Handset Applications
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, Sungyoon | - |
dc.contributor.author | Kim, Unha | - |
dc.contributor.author | Kim, Junghyun | - |
dc.date.accessioned | 2021-06-22T20:42:56Z | - |
dc.date.available | 2021-06-22T20:42:56Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2015-01 | - |
dc.identifier.issn | 1531-1309 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/19253 | - |
dc.description.abstract | Fully-integrated multi-mode multi-band (MMMB) reconfigurable power amplifier (PA) is implemented using single PA-cores for high-and low-frequency bands, respectively. This PA has five output paths and covers quad-band Gaussian Minimum Shift Keying/Enhanced Data Rates for Global Evolution and penta-band Universal Mobile Telecommunications System/Long Term Evolution mode operation with band combination in a small form-factor. To optimize the PA, the proposed structure reconfigures the PA-core cells as well as the interstage/output matching network. When compared with the single-mode single-band dedicated PAs, the fabricated PA showed comparable RF performance for all modes and bands, except for PAE degradations of 3.1% and 1.9% for high-and low-band, respectively, thus validating the usefulness of the proposed structure for MMMB PA applications. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | A Multi-Mode Multi-Band Reconfigurable Power Amplifier for 2G/3G/4G Handset Applications | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Junghyun | - |
dc.identifier.doi | 10.1109/LMWC.2014.2367164 | - |
dc.identifier.scopusid | 2-s2.0-84920889338 | - |
dc.identifier.wosid | 000347695700017 | - |
dc.identifier.bibliographicCitation | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.25, no.1, pp.49 - 51 | - |
dc.relation.isPartOf | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | - |
dc.citation.title | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | - |
dc.citation.volume | 25 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 49 | - |
dc.citation.endPage | 51 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.subject.keywordAuthor | Multi-band | - |
dc.subject.keywordAuthor | multi-mode | - |
dc.subject.keywordAuthor | penta-band UMTS/LTE | - |
dc.subject.keywordAuthor | quad-band GMSK/EDGE | - |
dc.subject.keywordAuthor | reconfigurable power amplifier (PA) | - |
dc.subject.keywordAuthor | single PA-core | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/6954521 | - |
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