Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeong, Yeon-Ah | - |
dc.contributor.author | Poddar, Maneesh Kumar | - |
dc.contributor.author | Ryu, Heon-Yul | - |
dc.contributor.author | Yerriboina, Nagendra Prasad | - |
dc.contributor.author | Kim, Tae-Gon | - |
dc.contributor.author | Kim, Jaehyun | - |
dc.contributor.author | Park, Jong-Dai | - |
dc.contributor.author | Lee, Mingun | - |
dc.contributor.author | Park, Chang-Yong | - |
dc.contributor.author | Han, Seongjun | - |
dc.contributor.author | Kim, Myeong-Jun | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.date.accessioned | 2021-06-22T09:26:06Z | - |
dc.date.available | 2021-06-22T09:26:06Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2019-10 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2093 | - |
dc.description.abstract | This research investigates abrasive particles agglomeration via interaction between O-2 bubbles and slurry abrasives during the tungsten chemical mechanical polishing (W CMP) process. The abrasive particles in slurry were highly agglomerated due to higher volumes of O-2 bubbles produced in the reaction between the catalyst Fe (NO3)8(3) and the oxidizer H2O2. Results obtained from a gas pressure sensor confirmed the generation of higher O-2 volume via the decomposition of H2O2 at a high catalyst concentration and an increase in reaction temperature. The decomposed O-2 volume rate at 80 degrees C was reported at the maximum value of 2.0 x 10(-2) L/s at 120 ppm as compared to the moderate and minimum rates of 3.5 x 10(-3) and 3.2 x 10(-4) L/s for catalyst concentrations of 60 and 30 ppm, respectively. Images of O-2 bubbles, captured using a high-speed camera, exhibited subsequent enhancement in average O-2 bubble diameters of 91, 427, and 503 mu m at 25, 60, and 80 degrees C, respectively. Analysis of surface scans confirmed large abrasive particles contamination on the TEOS wafer with an increase in the O-2 bubble flow rate and bubbling time. Also, large abrasive particles agglomeration was observed in the presence of O-2 bubbles as compared to no bubbles, as measured by dynamic light scattering DLS. It is believed that higher hydrophilicity of abrasive particles with O-2 bubbles increased the adhesive force between the abrasive particles and the in-situ generated O-2 bubbles. The high drag force generated during the collapse of O-2 bubbles is essentially attributed a strong attractive force between the abrasive particles and the TEOS wafer which strongly binds with the abrasive particles and intensifies the defect level as particle agglomeration. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Elsevier BV | - |
dc.title | Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Tae-Gon | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1016/j.mee.2019.111133 | - |
dc.identifier.scopusid | 2-s2.0-85073172406 | - |
dc.identifier.wosid | 000498756000001 | - |
dc.identifier.bibliographicCitation | Microelectronic Engineering, v.218, pp.1 - 6 | - |
dc.relation.isPartOf | Microelectronic Engineering | - |
dc.citation.title | Microelectronic Engineering | - |
dc.citation.volume | 218 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 6 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | DETACHMENT | - |
dc.subject.keywordPlus | REMOVAL | - |
dc.subject.keywordPlus | SURFACE | - |
dc.subject.keywordPlus | SLURRY | - |
dc.subject.keywordPlus | Adhesives | - |
dc.subject.keywordPlus | Agglomeration | - |
dc.subject.keywordPlus | Catalysts | - |
dc.subject.keywordPlus | Chemical mechanical polishing | - |
dc.subject.keywordPlus | Drag | - |
dc.subject.keywordPlus | Dynamic light scattering | - |
dc.subject.keywordPlus | High speed cameras | - |
dc.subject.keywordPlus | Hydrophilicity | - |
dc.subject.keywordPlus | Image enhancement | - |
dc.subject.keywordPlus | Iron compounds | - |
dc.subject.keywordPlus | Oxygen | - |
dc.subject.keywordPlus | Polishing | - |
dc.subject.keywordPlus | Tungsten | - |
dc.subject.keywordAuthor | W CMP | - |
dc.subject.keywordAuthor | O-2 bubble | - |
dc.subject.keywordAuthor | Fe(NO3)(3) | - |
dc.subject.keywordAuthor | Large abrasive particles ratio | - |
dc.subject.keywordAuthor | Abrasive particles agglomeration | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0167931719302898?via%3Dihub | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.