Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process
- Authors
- Jeong, Yeon-Ah; Poddar, Maneesh Kumar; Ryu, Heon-Yul; Yerriboina, Nagendra Prasad; Kim, Tae-Gon; Kim, Jaehyun; Park, Jong-Dai; Lee, Mingun; Park, Chang-Yong; Han, Seongjun; Kim, Myeong-Jun; Park, Jin-Goo
- Issue Date
- Oct-2019
- Publisher
- Elsevier BV
- Keywords
- W CMP; O-2 bubble; Fe(NO3)(3); Large abrasive particles ratio; Abrasive particles agglomeration
- Citation
- Microelectronic Engineering, v.218, pp.1 - 6
- Indexed
- SCIE
SCOPUS
- Journal Title
- Microelectronic Engineering
- Volume
- 218
- Start Page
- 1
- End Page
- 6
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2093
- DOI
- 10.1016/j.mee.2019.111133
- ISSN
- 0167-9317
- Abstract
- This research investigates abrasive particles agglomeration via interaction between O-2 bubbles and slurry abrasives during the tungsten chemical mechanical polishing (W CMP) process. The abrasive particles in slurry were highly agglomerated due to higher volumes of O-2 bubbles produced in the reaction between the catalyst Fe (NO3)8(3) and the oxidizer H2O2. Results obtained from a gas pressure sensor confirmed the generation of higher O-2 volume via the decomposition of H2O2 at a high catalyst concentration and an increase in reaction temperature. The decomposed O-2 volume rate at 80 degrees C was reported at the maximum value of 2.0 x 10(-2) L/s at 120 ppm as compared to the moderate and minimum rates of 3.5 x 10(-3) and 3.2 x 10(-4) L/s for catalyst concentrations of 60 and 30 ppm, respectively. Images of O-2 bubbles, captured using a high-speed camera, exhibited subsequent enhancement in average O-2 bubble diameters of 91, 427, and 503 mu m at 25, 60, and 80 degrees C, respectively. Analysis of surface scans confirmed large abrasive particles contamination on the TEOS wafer with an increase in the O-2 bubble flow rate and bubbling time. Also, large abrasive particles agglomeration was observed in the presence of O-2 bubbles as compared to no bubbles, as measured by dynamic light scattering DLS. It is believed that higher hydrophilicity of abrasive particles with O-2 bubbles increased the adhesive force between the abrasive particles and the in-situ generated O-2 bubbles. The high drag force generated during the collapse of O-2 bubbles is essentially attributed a strong attractive force between the abrasive particles and the TEOS wafer which strongly binds with the abrasive particles and intensifies the defect level as particle agglomeration.
- Files in This Item
-
Go to Link
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
- COLLEGE OF ENGINEERING SCIENCES > MAJOR IN APPLIED MATERIAL & COMPONENTS > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.