Multifunctional Ru-AlN heating resistor films for high efficiency inkjet printhead
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Woo-Chang | - |
dc.contributor.author | Wan, Zhixin | - |
dc.contributor.author | Ahn, Ji-Hoon | - |
dc.contributor.author | Kim, Doo-In | - |
dc.contributor.author | Shin, Seung-Yong | - |
dc.contributor.author | Moon, Kyung-Il | - |
dc.contributor.author | Park, Jin-Seong | - |
dc.contributor.author | Kwon, Jung-Dae | - |
dc.contributor.author | Kwon, Se-Hun | - |
dc.date.accessioned | 2021-06-22T23:24:20Z | - |
dc.date.available | 2021-06-22T23:24:20Z | - |
dc.date.issued | 2014-05 | - |
dc.identifier.issn | 1385-3449 | - |
dc.identifier.issn | 1573-8663 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/22881 | - |
dc.description.abstract | Ru-AlN thin films were suggested as a novel multifunctional heating resistor film for non-passivated type thermal inkjet printer devices. Ru-AlN thin films were prepared by plasma-enhanced atomic layer deposition in order to intermix Ru and AlN precisely. When the Ru intermixing ratios were optimized, Ru-AlN films showed a favorable electrical resistivity (from 490.9 to 75.3 mu Omega cm) and minimized temperature coefficient of resistance (TCR) values (from 335 to 360 ppm/K). Moreover, the Ru-AlN films showed a strong oxidation resistant as compared with commercially used TaN0.8 films because the prepared Ru-AlN thin films had a typical nanocomposite structure. By applying electrical pulses to the heater device using Ru-AlN thin films for a Joule heating, a reliable operation was also proven. | - |
dc.format.extent | 6 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Kluwer Academic Publishers | - |
dc.title | Multifunctional Ru-AlN heating resistor films for high efficiency inkjet printhead | - |
dc.type | Article | - |
dc.publisher.location | 네델란드 | - |
dc.identifier.doi | 10.1007/s10832-013-9880-2 | - |
dc.identifier.scopusid | 2-s2.0-84904736204 | - |
dc.identifier.wosid | 000339721700018 | - |
dc.identifier.bibliographicCitation | Journal of Electroceramics, v.32, no.2-3, pp 240 - 245 | - |
dc.citation.title | Journal of Electroceramics | - |
dc.citation.volume | 32 | - |
dc.citation.number | 2-3 | - |
dc.citation.startPage | 240 | - |
dc.citation.endPage | 245 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
dc.subject.keywordPlus | TEMPERATURE-COEFFICIENT | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | RESISTIVITY | - |
dc.subject.keywordAuthor | Thermal inkjet printer | - |
dc.subject.keywordAuthor | Platinum group metals | - |
dc.subject.keywordAuthor | Plasma-enhanced atomic layer deposition | - |
dc.subject.keywordAuthor | Multifunctional thin films | - |
dc.identifier.url | https://link.springer.com/article/10.1007/s10832-013-9880-2?utm_source=getftr&utm_medium=getftr&utm_campaign=getftr_pilot | - |
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