저온소결조건에 따른 폴리이미드 가판 위에 도포한 전도성 Ag잉크의 계면변화에 따른 전기적 특성 분석
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김종렬 | - |
dc.date.accessioned | 2021-06-23T00:52:16Z | - |
dc.date.available | 2021-06-23T00:52:16Z | - |
dc.date.issued | 2009-05-21 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/24872 | - |
dc.title | 저온소결조건에 따른 폴리이미드 가판 위에 도포한 전도성 Ag잉크의 계면변화에 따른 전기적 특성 분석 | - |
dc.type | Conference | - |
dc.citation.conferenceName | 2009 춘계학술발표대회 및 제 16회 신소재 심포지엄 | - |
dc.citation.conferencePlace | 무주리조트 티롤호텔 | - |
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