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Effect of defects on extreme ultraviolet pellicle

Authors
Kim, In-SeonKim, Guk-JinYeung, MichaelBarouch, EytanKim, Mun-JaKim, Seong-SueKim, Ji-WonOh, Hye-Keun
Issue Date
Mar-2014
Publisher
SPIE
Keywords
contamination; defect; EUV lithography; pellicle
Citation
Proceedings of SPIE - The International Society for Optical Engineering, v.9048, pp 1 - 9
Pages
9
Indexed
SCIE
SCOPUS
Journal Title
Proceedings of SPIE - The International Society for Optical Engineering
Volume
9048
Start Page
1
End Page
9
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/25451
DOI
10.1117/12.2046171
ISSN
0277-786X
Abstract
Over the past several years, people have accomplished a great deal of developing the Extreme-ultraviolet lithography (EUVL) technologies. However, several problems which disturb the mass-production of EUVL still remain. One of the problems is the defect control. In order to protect the mask from defect, the usage of the pellicle is essential. However the transmission loss caused by contamination can lead to the pattern error. Therefore it is necessary to find the acceptable thickness of the contamination layer that would cause the image error. The protection ability of the pellicle in terms of critical dimension variation is studied. Our study indicated that the process latitude difference is small enough to ignore whether the pellicle is used or not. In addition the protection ability of pellicle is good against the case of conformal contamination in terms of CD variation. © 2014 SPIE.
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles

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