Investigation of Cu-BTA Complex Formation and Removal on Various Cu Surface Conditions
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Byoung-Jun | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.contributor.author | Shima, Shohei | - |
dc.contributor.author | Hamada, Satomi | - |
dc.date.accessioned | 2021-06-23T01:43:36Z | - |
dc.date.available | 2021-06-23T01:43:36Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2014-11 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/25872 | - |
dc.description.abstract | The effect of Cu surface conditions on Cu-BTA complex was investigated using ex-situ electrochemical impedance spectroscopy method. Cu-BTA complex is generated during Cu CMP process because BTA which is the most common corrosion inhibitor in Cu CMP slurry react with Cu and form a strong complex. Then it is very important to remove Cu-BTA complex during post-Cu CMP cleaning because Cu-BTA complex cause severe problem such as particle contamination and watermark due to its hydrophobic characteristic. The Cu-BTA complex formation at various Cu surfaces was investigated to understand its behavior, so the effective development will be possible in post-Cu CMP cleaning process. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IEEE | - |
dc.title | Investigation of Cu-BTA Complex Formation and Removal on Various Cu Surface Conditions | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1109/ICPT.2014.7017249 | - |
dc.identifier.scopusid | 2-s2.0-84925352089 | - |
dc.identifier.wosid | 000380459700020 | - |
dc.identifier.bibliographicCitation | 2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT), pp.70 - 74 | - |
dc.relation.isPartOf | 2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) | - |
dc.citation.title | 2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) | - |
dc.citation.startPage | 70 | - |
dc.citation.endPage | 74 | - |
dc.type.rims | ART | - |
dc.type.docType | Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.subject.keywordPlus | CHEMICAL-MECHANICAL PLANARIZATION | - |
dc.subject.keywordPlus | BENZOTRIAZOLE | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | SPECTROSCOPY | - |
dc.subject.keywordPlus | ADSORPTION | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | PH | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/7017249 | - |
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