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Study of Temperature Behaviors for a Pellicle in Extreme-Ultraviolet Lithography: Mesh Structure

Authors
Kim, In-SeonKim, Ji-WonOh, Hye-Keun
Issue Date
Dec-2013
Publisher
IOP Publishing Ltd
Citation
Japanese Journal of Applied Physics, v.52, no.12, pp.1 - 5
Indexed
SCIE
SCOPUS
Journal Title
Japanese Journal of Applied Physics
Volume
52
Number
12
Start Page
1
End Page
5
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/26290
DOI
10.7567/JJAP.52.126506
ISSN
0021-4922
Abstract
We report a theoretical study of the temperature behavior for a mesh structure of a pellicle in extreme-ultraviolet (EUV) lithography. Based on our modified heat transfer model, we calculate the temperature dependence of the pellicle mesh on the mesh materials and the structural parameters. The calculated results show that temperature change of the mesh is much slower than the thin film due to its high heat capacity and its saturation temperature has strong dependence on the material and the ratio of the cross-sectional area of the line to the side-cooling surface area of the mesh. Thermal damage is again minimal for the mesh support as is the case of a thin pellicle film. (C) 2013 The Japan Society of Applied Physics
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF PHOTONICS AND NANOELECTRONICS > 1. Journal Articles

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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY (DEPARTMENT OF PHOTONICS AND NANOELECTRONICS)
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