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The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma

Authors
Kim, Kwang-SeokBang, Jae-OhChoa, Yong-HoJung, Seung-Boo
Issue Date
Jul-2013
Publisher
Elsevier BV
Keywords
Copper nanopaste; Screen printing; Atmospheric-pressure plasma; Plasma sintering
Citation
Microelectronic Engineering, v.107, pp.121 - 124
Indexed
SCIE
SCOPUS
Journal Title
Microelectronic Engineering
Volume
107
Start Page
121
End Page
124
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/27557
DOI
10.1016/j.mee.2012.08.019
ISSN
0167-9317
Abstract
There are two main technologies for the commercialization of printable and flexible electronic devices. One is the manufacture of nanomaterials such as nanoinks and nanopastes that include conducting nanoparticles, and another is heat treatment at lower temperatures. Copper (Cu) nanopaste and atmospheric-pressure plasma (APP) sintering is highly adoptable for mass production of printable and flexible electronic devices at low cost. The relation between the microstructure of screen-printed Cu nanopaste and its electrical properties was investigated. The characteristics of Cu patterns sintered by APP were compared to those sintered by conventional radiation-conduction-convection heating. The Cu patterns sintered at 250 W for 40 min showed the lowest electrical resistivity of 21.06 mu Omega cm, which is around 12.61 times of the bulk Cu. All of the Cu pattern surfaces sintered by APP showed lower oxygen concentrations than those sintered by conventional heating. (C) 2012 Elsevier B.V. All rights reserved.
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CHOA, YONG HO
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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