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Plating Condition Effect on the CMP Dishing and Mechanical Property of Electroplated Cu Film
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 안유민 | - |
| dc.date.accessioned | 2021-06-23T03:10:56Z | - |
| dc.date.available | 2021-06-23T03:10:56Z | - |
| dc.date.issued | 2007-01-11 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/27816 | - |
| dc.title | Plating Condition Effect on the CMP Dishing and Mechanical Property of Electroplated Cu Film | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 8th International Symposium on Eco-Materails Processing and Design | - |
| dc.citation.conferencePlace | Kitakyushu, Japan | - |
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Related Researcher
- Ahn, Yoomin
- ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)