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Plating Condition Effect on the CMP Dishing and Mechanical Property of Electroplated Cu Film
- Authors
- 안유민
- Issue Date
- 11-Jan-2007
- Place
- Kitakyushu, Japan
- Conference Name
- The 8th International Symposium on Eco-Materails Processing and Design
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Related Researcher
- Ahn, Yoomin
- ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)