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Image Processing Algorithm for Real-Time Crack Inspection in Hole Expansion Test

Authors
Choi, SeunghoKim, KwangyoonLee, JaehoPark, Sung HyukLee, Hye-JinYoon, Jonghun
Issue Date
Jul-2019
Publisher
KOREAN SOC PRECISION ENG
Keywords
Crack; Imaging processing; Hole expansion ratio (HER); Greyscale value; Binarization; Zinc-coating
Citation
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.20, no.7, pp.1139 - 1148
Indexed
SCIE
SCOPUS
KCI
Journal Title
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
Volume
20
Number
7
Start Page
1139
End Page
1148
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2787
DOI
10.1007/s12541-019-00101-4
ISSN
2234-7593
Abstract
This paper mainly focuses on development of the smart crack inspection algorithm facilitating the through-thickness crack during the hole expansion test, which makes it possible to calculate the hole expansion ratio, automatically, with the image processing technique. The proposed crack inspection algorithm consists of six steps such as binarization, blob detection, background deletion, ROI selection, image linearization, and crack identification using the C# language. This algorithm is able to capture the various types of the through-thickness and double cracks irrespective of the reflectance and the initial thickness of the applied sheet materials. In addition, it is possible to keep trace of the in-plane crack and its propagation during the HER test.
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ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)
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