Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography
- Authors
- Muhammad, Rizwan; Cho, Si-Hyeong; Lee, Jung-Hwan; Park, Jin-Goo
- Issue Date
- Apr-2013
- Publisher
- Elsevier BV
- Keywords
- Nanoimprint lithography; Nanoimprint molds; Electroforming; Antistiction films; Fluorocarbon coating; Cobalt-nickel
- Citation
- Microelectronic Engineering, v.104, pp.58 - 63
- Indexed
- SCIE
SCOPUS
- Journal Title
- Microelectronic Engineering
- Volume
- 104
- Start Page
- 58
- End Page
- 63
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/28462
- DOI
- 10.1016/j.mee.2012.11.006
- ISSN
- 0167-9317
- Abstract
- The availability of durable molds with nanometer-scale features is a bottleneck for nanoimprint lithography and nano-injection molding. Silicon (Si) nanomolds are typically fabricated by electron beam lithography, which is a very expensive technology, and furthermore, the lifetime of the Si mold is also short. This paper presents a very cost effective method for the fabrication of wafer level CoNi nanomolds with an improved residual stress profile without the consumption of a silicon mother mold. For this purpose, a 20 nm fluorocarbon antistiction film was applied to the silicon mold prior to seed layer deposition and electroplating to ease the separation of the metal mold without sacrificing a costly mother mold. Step coverage of the fluorocarbon film was found to be dependent on the aspect ratio of nanoscale features. The degree and nature of the stress, as well as the cobalt content in the electroformed mold, were controlled by changing the anode-to-cathode gap. A 6-inch CoNi nanomold was successfully duplicated without consuming the mother mold with this method. (C) 2012 Elsevier B.V. All rights reserved.
- Files in This Item
-
Go to Link
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.