IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joonhyun | - |
dc.contributor.author | Eo, Yungseon | - |
dc.date.accessioned | 2021-06-22T10:02:16Z | - |
dc.date.available | 2021-06-22T10:02:16Z | - |
dc.date.issued | 2019-06 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.issn | 2156-3985 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/2889 | - |
dc.description.abstract | In this paper, over a broad frequency band, a novel transmission line (TL) characterization method for highly-lossy miniaturized integrated circuit (IC) interconnect lines is presented. TLs fabricated on lossy organic substrates are difficult to characterize in a broad frequency band due to frequency-dependent losses and resonances. Test TLs are fabricated using a packaging process that employs an organic substrate and then characterized by using a vector network analyzer up to 40 GHz. TLs are modeled as a function of frequency by combining the modified skin effect model with experimental S-parameter data. Parallel admittance of TLs can be yielded by unifying the propagation constant with the frequency-variant resistance and inductance models, followed by TL characterization. It is verified that IC package interconnect lines can be reliably characterized up to high frequencies. | - |
dc.format.extent | 9 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1109/TCPMT.2019.2898671 | - |
dc.identifier.scopusid | 2-s2.0-85067111750 | - |
dc.identifier.wosid | 000470984600015 | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp 1133 - 1141 | - |
dc.citation.title | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.citation.volume | 9 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 1133 | - |
dc.citation.endPage | 1141 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordAuthor | Organic substrate | - |
dc.subject.keywordAuthor | signal integrity | - |
dc.subject.keywordAuthor | S-parameters | - |
dc.subject.keywordAuthor | transmission line (TL) modeling | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/8638969 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.