Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Two-step flash light sintering process for crack-free inkjet-printed Ag films

Full metadata record
DC Field Value Language
dc.contributor.authorPark, Sung-Hyeon-
dc.contributor.authorJang, Shin-
dc.contributor.authorLee, Dong-Jun-
dc.contributor.authorOh, Jehoon-
dc.contributor.authorKim, Hak-Sung-
dc.date.accessioned2021-06-23T04:22:30Z-
dc.date.available2021-06-23T04:22:30Z-
dc.date.created2021-01-21-
dc.date.issued2013-01-
dc.identifier.issn0960-1317-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/29229-
dc.description.abstractIn this paper, a two-step flash light sintering process for inkjet-printed Ag films is investigated with the aim of improving the quality of sintered Ag films. The flash light sintering process is divided into two steps: a preheating step and a main sintering step. The preheating step is used to remove the organic binder without abrupt vaporization. The main sintering step is used to complete the necking connections among the silver nanoparticles and achieve high electrical conductivity. The process minimizes the damage on the polymer substrate and the interface between the sintered Ag film and polymer substrate. The electrical conductivity is calculated by measuring the resistance and cross-sectional area with an LCR meter and 3D optical profiler, respectively. It is found that the resistivity of the optimal flash light-sintered Ag films (36.32 n Omega m), which is 228.86% of that of bulk silver, is lower than that of thermally sintered ones (40.84 n Omega m). Additionally, the polyimide film used as the substrate is preserved with the inkjet-printed pattern shape during the flash light sintering process without delamination or defects.-
dc.language영어-
dc.language.isoen-
dc.publisherIOP PUBLISHING LTD-
dc.titleTwo-step flash light sintering process for crack-free inkjet-printed Ag films-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Jehoon-
dc.identifier.doi10.1088/0960-1317/23/1/015013-
dc.identifier.scopusid2-s2.0-84878129138-
dc.identifier.wosid000312248200013-
dc.identifier.bibliographicCitationJOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.1, pp.1 - 9-
dc.relation.isPartOfJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.citation.titleJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.citation.volume23-
dc.citation.number1-
dc.citation.startPage1-
dc.citation.endPage9-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaInstruments & Instrumentation-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryInstruments & Instrumentation-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusTHIN-FILM-
dc.subject.keywordPlusSILVER-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordPlusCONDUCTIVITY-
dc.subject.keywordPlusFTIR-
dc.subject.keywordAuthorNANOPARTICLES-
dc.subject.keywordAuthorCONDUCTIVITY-
dc.subject.keywordAuthorFTIR-
dc.subject.keywordAuthorSILVER-
dc.subject.keywordAuthorTHIN-FILM-
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/0960-1317/23/1/015013-
Files in This Item
Go to Link
Appears in
Collections
COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MECHANICAL ENGINEERING > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Oh, Je Hoon photo

Oh, Je Hoon
ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)
Read more

Altmetrics

Total Views & Downloads

BROWSE