Two-step flash light sintering process for crack-free inkjet-printed Ag films
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Sung-Hyeon | - |
dc.contributor.author | Jang, Shin | - |
dc.contributor.author | Lee, Dong-Jun | - |
dc.contributor.author | Oh, Jehoon | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2021-06-23T04:22:30Z | - |
dc.date.available | 2021-06-23T04:22:30Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2013-01 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/29229 | - |
dc.description.abstract | In this paper, a two-step flash light sintering process for inkjet-printed Ag films is investigated with the aim of improving the quality of sintered Ag films. The flash light sintering process is divided into two steps: a preheating step and a main sintering step. The preheating step is used to remove the organic binder without abrupt vaporization. The main sintering step is used to complete the necking connections among the silver nanoparticles and achieve high electrical conductivity. The process minimizes the damage on the polymer substrate and the interface between the sintered Ag film and polymer substrate. The electrical conductivity is calculated by measuring the resistance and cross-sectional area with an LCR meter and 3D optical profiler, respectively. It is found that the resistivity of the optimal flash light-sintered Ag films (36.32 n Omega m), which is 228.86% of that of bulk silver, is lower than that of thermally sintered ones (40.84 n Omega m). Additionally, the polyimide film used as the substrate is preserved with the inkjet-printed pattern shape during the flash light sintering process without delamination or defects. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Two-step flash light sintering process for crack-free inkjet-printed Ag films | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Jehoon | - |
dc.identifier.doi | 10.1088/0960-1317/23/1/015013 | - |
dc.identifier.scopusid | 2-s2.0-84878129138 | - |
dc.identifier.wosid | 000312248200013 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.1, pp.1 - 9 | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 23 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 9 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | THIN-FILM | - |
dc.subject.keywordPlus | SILVER | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | CONDUCTIVITY | - |
dc.subject.keywordPlus | FTIR | - |
dc.subject.keywordAuthor | NANOPARTICLES | - |
dc.subject.keywordAuthor | CONDUCTIVITY | - |
dc.subject.keywordAuthor | FTIR | - |
dc.subject.keywordAuthor | SILVER | - |
dc.subject.keywordAuthor | THIN-FILM | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1088/0960-1317/23/1/015013 | - |
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