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Hot Embossing을 이용한 플라스틱 CE칩 제작

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dc.contributor.author박진구-
dc.date.accessioned2021-06-23T04:52:29Z-
dc.date.available2021-06-23T04:52:29Z-
dc.date.issued2004-11-05-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/30006-
dc.titleHot Embossing을 이용한 플라스틱 CE칩 제작-
dc.typeConference-
dc.citation.conferenceName2004 한국재료학회 추계학술발표대회-
dc.citation.conferencePlace인하대학교-
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers

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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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